BIRNS Millennium miniature high-density metal shell connectors are rigorously qualified and tested, as follows:
Qualification Testing. BIRNS Millennium connectors are qualification-tested to:
- MIL-STD-1344A, "Test Methods for Electrical Connectors", Test Method 3001.1, "Dielectric Withstanding Voltage"
- NAVMAT P-9290, "System Certification Procedures and Critera Manual for Deep Submergence Systems", Appendix C, "Design Parameters for Implodable Items".
A bulkhead-penetrating connector (FR, BR, OR) is part of a pressure boundary and its insert is the final pressure barrier, so we qualify bulkhead-penetrating connectors to NAVMAT P-9290 as a "Category 3" item.
The net result: Millennium connectors reliably withstand open-face
pressure (Class A).
[A leading competitor states regarding its own connectors: "Open face pressure resistance is available on most bulkhead connectors (except those with coax contacts) and must be specified when ordering."]
Performance Testing. BIRNS Millennium connectors are performance-tested to:
- MIL-STD-1344A, "Test Methods for Electrical Connectors", Test Method 3003.1, "Insulation Resistance", Test Condition 'I'
- MIL-STD-1344A, "Test Methods for Electrical Connectors", Test Method 1006.1, "Hydrostatic Pressure", Test Condition 'D'
- MIL-STD-1344A, "Test Methods for Electrical Connectors", Test Method 2017, "Cable Seal Flexing"
- Design Standards. BIRNS Millennium connectors are designed to these standards:
- MIL-STD-39029D, "Contacts, Electrical Connector", for size, solder pot size, and functional contact engagement (thus, BIRNS Millennium connectors offer 22 AWG, 20 AWG, 16 AWG, 14 AWG, and 10 AWG contacts, without need for cumbersome incompatible "Regular and Long" shell sizes)
- MAN-4000-001, "Engineering Manual"
- Production Standards. BIRNS Millennium connectors are produced to these standards:
MIL-G-45204C, "Gold Plating, Electrodeposited", Type II, Grade D, Class 1 (50 microns of nickel under 50 microns of hard gold). Qualification Testing per MIL-G-45204 sections:
- 4.5.2.1 (Bend Test)
- 4.5.2.2 (Cutting Test)
- 4.5.2.3 (Baking Test)
To save money, most connector manufacturers use a thin nickel "flash" under a thin layer of gold (this often leads to gold flaking), but nonetheless claim gold plating "per MIL-G-45204"-- because MIL-G-45204 specifies plating as thin as 20 microns! Always ask for the gold plating "Class" or thickness.
- MIL-S-45743E, "Soldering, Manual Type, High Reliability"
- IPC-A-610C, "Acceptability for Electronic Assemblies"
- Section 4 ("Mechanical Assembly")
- Section 6 ("Soldering")
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